SPECIFICATIONS HX432C16PB3/32 32GB 4G x 64-Bit DDR4-3200 CL16 288-Pin DIMM Continued >> FEATURES HyperX HX432C16PB3/32 is a 4G x 64-bit (32GB) DDR4-3200 CL16 SDRAM (Synchronous DRAM) 2Rx8, memory module, based on sixteen 2G x 8-bit FBGA components per module. Each module kit supports Intel® Extreme Memory Profiles (Intel® XMP) 2.0. Each module has been tested to run at DDR4-3200 at a low latency timing of 16-19-19 at 1.35V. The SPDs are programmed to JEDEC standard latency DDR4-2400 timing of 17-17-17 at 1.2V. Each 288-pin DIMM uses gold contact fingers. The JEDEC standard electrical and mechanical specifications are as follows: CL(IDD) Row Cycle Time (tRCmin) Refresh to Active/Refresh Command Time (tRFCmin) Row Active Time (tRASmin) UL Rating Operating Temperature Storage Temperature 17 cycles 45.75ns(min.) 350ns(min.) 32ns(min.) 94 V – 0 0o C to +85o C -55o C to +100o C XMP TIMING PARAMETERS Power Supply: VDD = 1.2V Typical VDDQ = 1.2V Typical VPP = 2.5V Typical VDDSPD = 2.2V to 3.6V On-Die termination (ODT) 16 internal banks; 4 groups of 4 banks each Bi-Directional Differential Data Strobe 8 bit pre-fetch Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop) Height 1.661 (42.20mm) Document No. 4809418A 04/14/20 Page 1 hyperxgaming.com HX432C16PB3/32 32GB 4G x 64-Bit DDR4 3200 CL16 288 Pin DIMM Memory Module Specifications Default (JEDEC): DDR4-2400 CL17-17-17 @1.2V XMP Profile #1: DDR4-3200 CL16-19-19 @1.35V XMP Profile #2: DDR4-3000 CL16-18-18 @1.35V https://www.kingston.com/dataSheets/HX432C16PB3_32.pdf